| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device miniaturized by reducing the size of an optical assembly and a method for miniaturizing the electronic device. SOLUTION: An electronic device 100 and a method for manufacturing the electronic device 100 are provided. The electronic device 100 has a substrate 110 to which at least first 185 and second 186 linear optical parts are fitted. The linear optical parts 185 and 186 have optical detection parts 205 and 206 and interface parts 225 and 226. The optical detection parts 205 and 206 are electrically connected to the interface parts 225 and 226. The optical detection parts 205 and 206 of the linear optical parts 185 and 186 are arranged along a first axis AA. At least one interface parts 225 of the first linear optical parts 185 is offset in a first direction 246 from the first axis AA. At least one interface part 226 of the second linear optical part 186 is offset in a second direction 244 different from the first direction 246. Since the optical parts 185 and 186 are arranged in such a way, the size of the electronic device 100 becomes small and the size of an arbitrary delivery incorporating the electronic device 100 becomes small.
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