| 摘要 |
PURPOSE: A wafer alignment apparatus and an alignment method appropriate for it are provided, which can align a wafer with one process by simplifying the alignment work of the wafer and also can prevent the increase of cost according as using a CCD. CONSTITUTION: The wafer alignment apparatus includes an XY table(1) and a chuck(3) which can be rotated by a rotation part(2) by being installed on the XY table and can fix a wafer(W) with a vacuum absorption pad. A number of line CCD(5) are arranged on a supporting bar(4) installed on a side of the chuck, and an illumination(6) is installed slopely so that the line CCD can read a wafer circumferent line and a die pattern line. And a control part(7) controls the illumination and the XY table and the rotation part, and performs an operation process by receiving an image signal from the line CCD.
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