发明名称 ONE SYSTEM MODULE FOR ELECTRIC/ELECTRONIC PRODUCTS
摘要 PROBLEM TO BE SOLVED: To provide one system module for an electric/electronic components capable of being reduced in size of the module by facilitating an application of the pin of the module to the product by disposing the pins at three sides. SOLUTION: Power pins 502 and signal pins 503 are distributed and disposed in a 'U-shaped' state at three sides of a case 501. An overall size of the module is contracted. Coupling holes for coupling the case to a heat sink are prepared at two places in an at least diagonal line direction of the four corners of the case. A plurality of connecting pins and its plurality of connecting pin inserting holes for electrically connecting a power board and a signal board to one another are complementarily prepared to simplify an assembling work.
申请公布号 JP2001223327(A) 申请公布日期 2001.08.17
申请号 JP20000385790 申请日期 2000.12.19
申请人 LG ELECTRONICS INC 发明人 HWANG MIN-KYU;LEE JAE-CHUN;LEE SANG-KYUN
分类号 H05K7/00;H01L25/07;H01L25/18;H05K1/14;H05K3/30;H05K5/00 主分类号 H05K7/00
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