CIRCUIT BOARD AND METHOD FOR FORMING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for cheaply manufacturing a high tension heavy current circuit board which can be highly densely packaged, and a structure of the same. SOLUTION: A front surface prepreg 11 made of an insulating resin, a conductive circuit patterns 14 and a rear surface prepreg 12 are used for this method. A part 16 is inserted into hollow parts 10A and 10B formed on the prepregs 11 and 12 and they are arranged on a conductive pattern so as to be packaged in a state that the part is separated by the prepregs. Thus, highly densely packaging, safety and reliability of the part can be improved.