| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-quality inexpensive non-contact IC card recording medium which is adaptive to various kinds of modules and cards and is excellent in durability and its production method. SOLUTION: A thermoplastic polymer resin to be inner surface base materials 2 and 3 is a non-crystalline thermoplastic polymer resin and the total thickness of the materials 2 and 3 is larger than the maximum thickness of an IC module. |
