| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package having one or a plurality of semiconductors, simple structure, excellent radiating effect and stable quality, and a method for manufacturing the same. SOLUTION: Electrodes of one side surface of the semiconductor 1 having electrodes on both side surfaces are connected directly to radiating plates 10, 14 and 40 to rapidly absorb and diffuse heat of the semiconductor, thereby improving the radiating effect. As connecting, connecting wires each having thicker than a bonding wire and larger current capacity than the bonding wire are used and used also as a connecting terminal to a circuit board. Ceramics are used as the radiating plate, and a semiconductor having a different function is simultaneously mounted. |
