发明名称 WATER-BASE PHOTO SOLDERING RESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a water-base photo soldering resist composition having no problem on storage stability, excellent in heat resistance and emitting no solvent odor. SOLUTION: The water-base photo soldering resist composition contains (A) an aqueous solution obtained by neutralizing a resin containing a radical polymerizable group and a carboxyl group with a base, (B) an inorganic filler, (C) a photo-curable composition comprising a polyfunctional acrylic monomer (c1), a compound (c2) having a cyclic ether group other than a glycidyl group and a photopolymerization initiator (c3) and, optionally, (D) an aqueous solution obtained by neutralizing a radical polymer having 130-230 mgKOH/g acid value with a base. The cyclic ether group may be an alicyclic epoxy group or an oxetane group.
申请公布号 JP2001222103(A) 申请公布日期 2001.08.17
申请号 JP20000168579 申请日期 2000.06.06
申请人 NIPPON PAINT CO LTD 发明人 YABUUCHI NAOYA;FUJITA MINORU;NANBA OSAMU;OKAJIMA KEIICHI
分类号 G03F7/027;C08F2/44;C08F2/46;C08F290/00;C08F299/00;C08G59/20;C08G59/42;C08K3/30;C08K3/34;C08K5/3417;C08K5/3437;C08L55/00;C08L63/00;C08L101/14;G03F7/004;G03F7/028;G03F7/032;G03F7/033;G03F7/038;H05K3/28 主分类号 G03F7/027
代理机构 代理人
主权项
地址