| 摘要 |
PROBLEM TO BE SOLVED: To effectively form a sealing part on a circuit board and to perform excellent productivity. SOLUTION: The method for manufacturing an electronic component comprises a step of coating a predetermined region of one main surface of a circuit board 2 formed with an electronic circuit on at least one main surface 2a with a radiation curable resin, and then a step of irradiating the resin with a light having a predetermined wavelength. In this case, the resin is cured by the step of irradiating with the light having the predetermined wavelength, and the sealing part 8 is formed on the predetermined region of the board 2.
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