| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of avoiding a state in which wirings of various type lengths are provided for an I/O circuit and avoiding a decrease in a wiring efficiency. SOLUTION: The semiconductor device comprises an I/O pad group having a predetermined number of I/O pads (201 to 216); and an I/O module disposed on a module special purpose region partitioned to include the I/O pad group, and a plurality of signal wirings 501 to 516 for coupling the I/O circuit group including I/O circuits 401 to 416 to be coupled to the pads (201 to 216), a predetermined number of the I/O pads (201 to 216) to the I/O circuit groups 401 to 416 and not extended out of the module.
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