发明名称 ELECTRONIC PART ASSEMBLY AND METHOD FOR MOUNTING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic part assembly for highly densely mounting chip parts on a body to be mounted in a short time without causing defectives due to positional deviation, and a method for manufacturing and mounting the same. SOLUTION: In the electronic part assemblies 3 and 5 in which two or more rectangular chip parts having electrodes on both sides are stacked in the longitudinal direction of the parts, insulating layers 2 and 4 are provided between the respective stacked chip parts.
申请公布号 JP2001223455(A) 申请公布日期 2001.08.17
申请号 JP20000029027 申请日期 2000.02.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIYAGAWA HIDEKI;YAMAUCHI MASARU;NAKADA MIKIYA;SAKAI YOSHINORI;WADA YOSHINORI;MORI KAZUHIRO
分类号 H01G4/228;H05K1/18 主分类号 H01G4/228
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