发明名称 |
ELECTRONIC PART ASSEMBLY AND METHOD FOR MOUNTING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part assembly for highly densely mounting chip parts on a body to be mounted in a short time without causing defectives due to positional deviation, and a method for manufacturing and mounting the same. SOLUTION: In the electronic part assemblies 3 and 5 in which two or more rectangular chip parts having electrodes on both sides are stacked in the longitudinal direction of the parts, insulating layers 2 and 4 are provided between the respective stacked chip parts. |
申请公布号 |
JP2001223455(A) |
申请公布日期 |
2001.08.17 |
申请号 |
JP20000029027 |
申请日期 |
2000.02.07 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MIYAGAWA HIDEKI;YAMAUCHI MASARU;NAKADA MIKIYA;SAKAI YOSHINORI;WADA YOSHINORI;MORI KAZUHIRO |
分类号 |
H01G4/228;H05K1/18 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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