| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a conductive contact unit for multipoint simultaneous measurement, to increase the strength of the whole support by a reinforcing material while preventing the thermal deformation of a support by composing the quality of material of the reinforcing material of heat resistance and a low thermal expansion coefficient, to improve accuracy at a low cost because of easy working by conducting the holder-hole working of a conductive contact to a synthetic resin material, to apply the support for a support for a conductive contact unit for a burn-in test at a wafer-level using a large number of the conductive contacts, and to reduce the working cost. SOLUTION: A support 1, to which holder holes 2 for a plurality of conductive contacts are disposed, is formed by insert-molding a heat resistant and low thermal expansion coefficient reinforcing material 3 to the synthetic resin material. The reinforcing material 3 is formed in a shape having openings 3a surrounding every collecting section at the chip unit of the holder holes and forming a discoidal shape as a whole reaching a section in the vicinity of the outer circumferential surface of the supporter.
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