| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device for positioning a thin plate which can position a thin plate placed on a table such as semiconductor element or the like by using a sliding means without pinching and bending the thin plate. SOLUTION: This device for positioning a thin plate is provided with a camera 50 which detects a mark on the specified position of a semiconductor element 10 placed on a stage 20, a claw member 30 for sliding and positioning the element so that the mark thereof may be within the visual field 54 of the camera 50, and a plurality of vacuum holes 24 to fix the element on the specified position of the stage when the mark of the element is detected and the position of the element is further detected. The stage 20 is provided with such a projecting placement table 22 on the upper surface thereof that is flat and larger in area than that of the element. Therefore, when the element is placed within the placement surface, the mark formed on one surface side of the element is formed in an area of the visual field of the camera, and the end surface of the claw member which is brought into contact with the projecting part of the element placed on the placement surface and slides the element is brought into contact with the side surface of the placement table.</p> |
