| 摘要 |
PROBLEM TO BE SOLVED: To solve problems of an excess material of a supporting board in a circuit device having a ceramic board or the like mounted with a circuit element as the supporting board, an increase in a size of the device in a thickness of the supporting board and a wear, a damage or the like of a blade for cutting the board in the dicing of the element to the one package. SOLUTION: After an isolating groove 54 is formed on a conductive foil 60, the circuit element is mounted, and covered with an insulating resin 50 with the foil 60 as a supporting board. Then, the foil 60 is inverted upside down, and with the resin 50 as the supporting board, the foil is polished and separated as a conductive path. Accordingly, a circuit device in which a conductive path 51 and a circuit element 52 are supported to the resin 50 can be realized without adopting the supporting board. Further, wirings absolutely necessary for the circuit are prevented from being drawn. Since the supporting board or the conductive path is not disposed on a part corresponding to the dicing line, a wear, a damage of a dicing blade can be largely suppressed. |
