OVERHEAT PROTECTION SOCKET FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An overheat protection socket for a semiconductor package is provided to prevent damage to the semiconductor package, the socket and a system, by detecting overheat and overcurrent of the socket on which the semiconductor package is mounted so that a switching operation is performed. CONSTITUTION: A semiconductor package(18) of a predetermined shape is pin-connected to a mounting region in an upper portion of a socket body(10), and a penetration hole(22) is formed in the mounting region. Pins for connection with a printed circuit board are disposed in a lower portion of the socket body. A heat detection sensor(12) is located in a lower portion while the semiconductor package is mounted in the penetration hole of the socket body, and is so connected to receive power from the printed circuit board. Current is supplied to the semiconductor package through a predetermined conductive path of the socket body. The heat detection sensor performs a switching operation according to the quantity of the supplied current and the heat-radiation state of the semiconductor package. An interconnection film(28) has the penetration hole the pins formed under the socket body penetrate and a connection hole(30) which terminals(24,26) of the heat detection sensor penetrate, coupled to a lower portion of the socket body. A pattern of a predetermined shape electrically connects one terminal of the heat detection sensor with lower pins connected to a power supply terminal of the semiconductor package of the socket body. The pattern of a predetermined shape is formed in the interconnection film.