SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To prevent the edge of a semiconductor chip from being shorted with the wiring of a film substrate in a device where the semiconductor chip is mounted on the film substrate. SOLUTION: In the film substrate 3, protrusions 5 which hemispherically protrude to an upper face are installed in accordance with bump electrodes 4 placed on the lower peripheral parts of the semiconductor chip 2. Wiring 6 is installed on the upper face of the film substrate 3. Wiring 6 has connection terminals 6a disposed on the upper faces of the protrusions 5. The semiconductor chip 2 is mounted on the film substrate 3 by jointing the bump electrodes 4 to the projecting end faces of the connection terminals 6a.