| 摘要 |
A method of manufacturing an unlanded via plug comprises the steps of providing a substrate having a conductive wire on the top surface of the substrate. A dielectric layer is formed on the substrate with a surface level between the top surface and the bottom surface of the conductive wire. An etching stop layer is formed over the substrate and the etching stop layer is planarized until exposing the surface of the conductive wire. Another dielectric layer is formed over the substrate, and then the dielectric layer is patterned to form a via hole and expose the conductive wire. Thereafter, the via hole is filled with a conductive material to form a via plug. |
