Testing semiconducting wafers involves electrically testing each chip on each wafer to identify sub-area with most wafers with more defective chips in sub-area than in surrounding area

摘要

The method involves dividing each wafer into areas and sub-areas, electrically testing each chip on each wafer, determining the fraction of chips per sub-area failing the test, determining the number of wafers per sub-area with a higher proportion of failing chips than in the surrounding area and outputting the sub-area with most wafers in which the proportion of defective chips in the sub-area is greater than in the surrounding area.