METHOD FOR MOUNTING INTEGRATED CIRCUITS ON A SUPPORT AND RESULTING SUPPORT

摘要

The invention concerns a support comprising a substrate (21) forming a frame bearing conductors (22) whereof some are arranged between at least two integrated circuits (11a-11f) positioned inside the frame such that their internal ends (221ai-221fi) are distributed into zones (a-f) corresponding to sites of integrated circuits to be connected to their respective bond pads. When the integrated circuits have a ground contact surface on their face opposite the surface with the bond pads, the mounting comprises a step which consists in forming on the substrate of the tape automated bonding support, additional conductors provided with respective internal conductors (223ai, 223di, 223fi) wider than those of the other conductors and folded to enable the other conductors to be connected to the bond pads of the integrated circuits and to be connected to the ground contact surfaces of the respective integrated circuits.