发明名称 METHOD FOR FORMING SILICIDE
摘要 PURPOSE: A method for forming a silicide is provided to improve a sheet resistance and a thermal stability of the silicide comprising a cobalt by growing a grain size of a P-type polysilicon. CONSTITUTION: According to the method, a polysilicon layer comprising a number of grains which are not doped on a substrate is formed. And the polysilicon layer is doped with a P-type impurity ion to give a conductivity. The polysilicon layer is re-doped with an ion which increases the grain size of the polysilicon layer if a heat is applied. A metal layer for forming a silicide is formed on the re-doped polysilicon layer. Then, silicide layers(40,41) for reducing a sheet resistance and a contact resistance respectively are formed by making a part of the polysilicon layer respond to the metal layer. The doping density of the redoped ion increasing the grain size is within a range of a critical doping density so that the doped ion shall not be precipitated out of the grain boundary.
申请公布号 KR20010076840(A) 申请公布日期 2001.08.16
申请号 KR20000004245 申请日期 2000.01.28
申请人 HYNIX SEMICONDUCTOR INC. 发明人 AHN, JAE GYEONG;LEE, GI MIN
分类号 H01L21/24;H01L21/28;H01L21/8238;H01L27/092;H01L29/78;(IPC1-7):H01L21/24 主分类号 H01L21/24
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