发明名称 |
METHOD FOR FORMING SILICIDE |
摘要 |
PURPOSE: A method for forming a silicide is provided to improve a sheet resistance and a thermal stability of the silicide comprising a cobalt by growing a grain size of a P-type polysilicon. CONSTITUTION: According to the method, a polysilicon layer comprising a number of grains which are not doped on a substrate is formed. And the polysilicon layer is doped with a P-type impurity ion to give a conductivity. The polysilicon layer is re-doped with an ion which increases the grain size of the polysilicon layer if a heat is applied. A metal layer for forming a silicide is formed on the re-doped polysilicon layer. Then, silicide layers(40,41) for reducing a sheet resistance and a contact resistance respectively are formed by making a part of the polysilicon layer respond to the metal layer. The doping density of the redoped ion increasing the grain size is within a range of a critical doping density so that the doped ion shall not be precipitated out of the grain boundary.
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申请公布号 |
KR20010076840(A) |
申请公布日期 |
2001.08.16 |
申请号 |
KR20000004245 |
申请日期 |
2000.01.28 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
AHN, JAE GYEONG;LEE, GI MIN |
分类号 |
H01L21/24;H01L21/28;H01L21/8238;H01L27/092;H01L29/78;(IPC1-7):H01L21/24 |
主分类号 |
H01L21/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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