发明名称 |
Substrate processing method and substrate processing apparatus |
摘要 |
A developing unit, a coating unit and a plurality of cooling plates are arranged in a process station which performs a resist coating and so on and a wafer is transferred among them by a substrate transfer device. The temperature of an area to where the wafer is transferred is detected by a temperature/humidity detector and the temperature of the wafer which is cooled by the cooling plates is adjusted accordingly based on a detected value so that the temperature of the wafer when transferred to the coating unit becomes a coating temperature of a processing solution. Thereby, the wafer is transferred to the coating unit while maintaining its temperature with high accuracy to be coated with a resist solution, so that a formation of an uneven processing due to the temperature change can be prevented and a uniform processing can be performed.
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申请公布号 |
US2001014372(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
US20000737473 |
申请日期 |
2000.12.18 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
KATANO TAKAYUKI;MATSUI HIDEFUMI;KITANO JUNICHI;SUZUKI YO;YAMASHITA MASAMI;AOYAMA TORU;IWAKI HIROYUKI;SHIMURA SATORU |
分类号 |
H01L21/027;B05C11/08;H01L21/00;H01L21/677;(IPC1-7):B05D3/00;B05C13/00 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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