发明名称 |
Electronic component, method of sealing electronic component with resin, and apparatus therefor |
摘要 |
A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.
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申请公布号 |
US2001013424(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
US20010777787 |
申请日期 |
2001.02.05 |
申请人 |
TAKASE SHINJI;OKAMOTO HIROTAKA;OSADA MICHIO;ARAKI KOUICHI |
发明人 |
TAKASE SHINJI;OKAMOTO HIROTAKA;OSADA MICHIO;ARAKI KOUICHI |
分类号 |
H01L21/56;(IPC1-7):H05K7/06 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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