MOUNTING STRUCTURE FOR SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor chip (3) is mounted on an insulating substrate (2). The insulating substrate (2) consists of polyimide, and at least the sides (3c) of the semiconductor chip (3) are protected by protective resin (5) consisting of polyimide. The protective resin (5) secures the semiconductor chip (3) on the insulating substrate (2). An adhesive layer (4), which also consists of polyimide, is preferably provided between the semiconductor chip (3) and the insulating substrate (2).