发明名称 |
Semiconductor device and method for producing a semiconductor device |
摘要 |
In a semiconductor device comprising a cylindrical storage node, the surface area of the storage node is increased by forming silicone grains in an amorphous silicone film by a heat treatment only to an outer wall of the cylindrical portion to thereby form a roughened surface in the outer wall, and the amorphous silicone film is left in an inner wall without conducting a surface roughening treatment to the inner wall whereby the physical strength of the cylindrical portion is maintained and the destruction and the breakage of the cylindrical portion are prevented.
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申请公布号 |
US2001013620(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
US20010833734 |
申请日期 |
2001.04.13 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
SHIROSAKI MASAMI;TSUCHIMOTO JUNICHI;MORI KIYOSHI |
分类号 |
H01L21/02;H01L21/20;H01L21/8239;H01L21/8242;H01L27/108;H01L29/76;H01L29/94;H01L31/119;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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