发明名称 Semiconductor device and method for producing a semiconductor device
摘要 In a semiconductor device comprising a cylindrical storage node, the surface area of the storage node is increased by forming silicone grains in an amorphous silicone film by a heat treatment only to an outer wall of the cylindrical portion to thereby form a roughened surface in the outer wall, and the amorphous silicone film is left in an inner wall without conducting a surface roughening treatment to the inner wall whereby the physical strength of the cylindrical portion is maintained and the destruction and the breakage of the cylindrical portion are prevented.
申请公布号 US2001013620(A1) 申请公布日期 2001.08.16
申请号 US20010833734 申请日期 2001.04.13
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SHIROSAKI MASAMI;TSUCHIMOTO JUNICHI;MORI KIYOSHI
分类号 H01L21/02;H01L21/20;H01L21/8239;H01L21/8242;H01L27/108;H01L29/76;H01L29/94;H01L31/119;(IPC1-7):H01L27/108 主分类号 H01L21/02
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