发明名称 SOLDER PASTE, SOLDERING METHOD USING SAID SOLDER PASTE AND JOINTED PRODUCT PREPARED BY SAID SOLDERING METHOD
摘要 <p>A solder paste which comprises a halogen compound as an activator in such an amount as to give a halogen ion concentration per 1 g of the flux used in the paste of 3,000 ppm or less in terms of a chlorine ion; a method for soldering using the solder paste; and a jointed product prepared by using the soldering method. The solder paste exhibits excellent storage stability.</p>
申请公布号 WO2001058639(P1) 申请公布日期 2001.08.16
申请号 JP2001000877 申请日期 2001.02.08
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