发明名称 METHOD FOR FABRICATING SOI(SILICON ON INSULATOR) MOS TRANSISTOR
摘要 PURPOSE: A method for fabricating a SOI(Silicon On Insulator) MOS transistor is provided to suppress a channel effect by reducing the thickness of a body area with a simple process. CONSTITUTION: A SOI(Silicon On Insulator) film(120) is formed which is separated from a semiconductor substrate(100) by a buried oxide(110). And the SOI film is separated by forming an oxide pattern(130) in the SOI film. And an amorphous silicon layer is formed on the separated SOI film and the oxide pattern. A crystallized silicon film(140) is formed by performing an annealing process to crystallize the amorphous silicon layer. And a gate insulation film(150) is formed on the crystallized silicon film, and a gate conductive film(160) is formed on the gate insulation film. And a source/drain region(180) is formed in the crystallized silicon film and the SOI film. The annealing process is performed by a laser annealing, RTA(Rapid Thermal Annealing) or SPE(Solid Phase Epitaxy) method.
申请公布号 KR20010076848(A) 申请公布日期 2001.08.16
申请号 KR20000004255 申请日期 2000.01.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAE, GEUM JONG;CHOI, TAE HUI;LEE, GYEONG UK;LEE, NAE IN
分类号 H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L29/78
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