发明名称 |
Surface-treated copper foil, method of producing the surface-treated copper foil, and cooper-clad laminate employing the surface-treated copper foil |
摘要 |
An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss of peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. The Another object is to impart excellent moisture resistance to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards which has been subjected to nodular treatment and anti-corrosion treatment of a surface of a copper foil, wherein the anti-corrosion treatment includes forming a zinc-copper (brass) plating layer on a surface of the copper foil; forming an electrodeposited chromate layer on the zinc-copper (brass) plating layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.
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申请公布号 |
US2001014410(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
US20010769252 |
申请日期 |
2001.01.26 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MITSUHASHI MASAKAZU;KATAOKA TAKASHI;TAKAHASHI NAOTOMI |
分类号 |
C25D11/38;C23C22/00;C23C22/24;C23C28/00;C23F15/00;C25D1/04;C25D3/38;C25D3/58;C25D5/10;C25D5/16;C25D5/48;C25D7/00;C25D7/06;H05K3/38;(IPC1-7):B32B15/08;C25D5/34;C25D5/00;B32B15/20 |
主分类号 |
C25D11/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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