发明名称 |
APPARATUS AND METHOD FOR EVALUATING PRINTED CIRCUIT BOARD ASSEMBLY MANUFACTURING PROCESSES |
摘要 |
A test coupon for measuring the effects of solder processes on circuit testability. The test coupon includes a circuit board having a multiplicity of circuit conductor patterns. Each conductor pattern is connected to a plurality of pads and vias on the circuit board. The circuit pads on an opposite surface of the circuit board support solder connections to a plurality of different circuit components. The circuit pads are connected to the vias, which in turn are connected to individual conductors of the circuit pattern. A surface connector is also supported on the circuit board, having pins extending through the circuit board. The circuit pattern conductors terminate on a respective connector pin. The test coupon may be subject to in-circuit testing where a value of the various components are measured. The multiple circuit patterns and mounted components permit different types of tester pins to be used to evaluate in-circuit testability in a test coupon used in a particular manufacturing process.
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申请公布号 |
US2001013786(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
US19980034404 |
申请日期 |
1998.03.04 |
申请人 |
CAGGIANO RAY J.;FURR BOYD H.;HATLEY JEFF A.;NOREIKA RICHARD J. |
发明人 |
CAGGIANO RAY J.;FURR BOYD H.;HATLEY JEFF A.;NOREIKA RICHARD J. |
分类号 |
G01R31/28;H05K1/02;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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