Electronic component used in semiconductor device comprises semiconductor chip having integrated circuits and metallic contact surfaces, and housing from which contact humps protrude

摘要

An electronic component (1) comprises a semiconductor chip (3) having integrated circuits and metallic contact surfaces (2); and a housing (4) from which contact humps (7) protrude. The humps are connected to the contact surfaces of the chip via a layer (5) with metallic conducting pathways. The pathways are formed together with the contact humps as one-piece integral component (8) made from a pre-finished metallic foil. An independent claim is also included for the production of an electronic component comprising forming a metallic foil with contact humps as a one-piece integral component; producing a self-supporting support layer (10) with openings for the humps and through-holes (27); connecting the foil to the humps and the support layer to form a composite part; structuring the foil to form a conducting path pattern; and connecting the conducting pathways to the contact surfaces of the chip in the region of the through-holes of the support layer.