RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED OBJECT
摘要
<p>A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfaalkylated so as to have improved hydrophilicity.</p>
申请公布号
WO0158978(A1)
申请公布日期
2001.08.16
申请号
WO2001JP00809
申请日期
2001.02.05
申请人
NAGOYA OILCHEMICAL CO., LTD.;HORIKI, SEINOSUKE;OGAWA, MASANORI;KAJITA, TAKEHIKO;ITOU, KUNINORI