The invention relates to a bipolar transistor (20) and to a method for producing the same. In order to obtain an as low a transition resistance as possible between the feed line (51) and the base (42), an intermediate layer (70) is provided between the first (30) and the second (40) layer, said intermediate layer (70) being selectively etchable to the second layer (40). At least in the zone of the undercut (43) between the feed line (51) and the base (42) a base connection zone (45) is provided that can be adjusted independent of other production conditions. The inventive transistor is further characterized in that the intermediate layer (70) is removed in the contact zone (46) with the base (42).
