发明名称 A PROCESS FOR FORMING A SEMICONDUCTOR STRUCTURE
摘要 High quality epitaxial layers of compound semiconductor materials can be gro wn overlying large silicon wafers by first growing an accommodating buffer laye r (24) on a silicon wafer (22). The accommodating buffer layer (24) is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer (28) of silicon oxide. The amorphous interface layer is preferably formed by oxygen diffusion through the oxide buffer and permits t he growth of a high quality monocrystalline oxide accommodating buffer layer. T he process further may comprise formation of template layers (28, 30) and a semiconducteur buffer layer (32). It's especially suited for cointegration o f compound semiconducteur and Si SMOS devices.
申请公布号 CA2399394(A1) 申请公布日期 2001.08.16
申请号 CA20012399394 申请日期 2001.02.08
申请人 MOTOROLA, INC. 发明人 RAMDANI, JAMAL;DROOPAD, RAVINDRANATH;EISENBEISER, KURT WILLIAM;HILT, LYNDEE L.
分类号 H01L21/331;C30B25/18;H01L21/20;H01L21/205;H01L21/316;H01L21/318;H01L21/822;H01L21/8222;H01L21/8232;H01L21/8234;H01L21/8238;H01L21/8248;H01L21/8249;H01L21/8252;H01L21/8258;H01L27/04;H01L27/06;H01L27/092;H01L27/095;H01L27/14;H01L27/15;H01L29/26;H01L29/267;H01L29/732;H01L33/16;H01L33/30;H01S5/02;H01S5/026;(IPC1-7):H01L21/20;H01L21/36;H01L21/825 主分类号 H01L21/331
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