发明名称 Electronic apparatus housing
摘要 The housing such as a computer casing comprises an enclosed body with side surfaces (11) and mounted thereon on either the inside or outside in order, a first heat conducting and electrically insulating layer (21), a peltier cooler (31), a second heat conducting and electrically insulating layer (41) and a heat dissipation plate (51). Control of current to the peltier cooler allows heat to be supplied to or drawn from the internal space of the housing to provide temperature control of the internal space. The enclosed body defines an enclosed space without air vents and protects the inside of the housing against damage from outside moisture and dust.
申请公布号 GB0115623(D0) 申请公布日期 2001.08.15
申请号 GB20010015623 申请日期 2001.06.27
申请人 CHU, DAH W 发明人
分类号 F25B21/02;H01L23/38;H01L35/30;H05K7/20 主分类号 F25B21/02
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