| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of controlling the pressure force to an abrasive pad or an abrasive plate of a dresser tool to be lower than the pressure force by a self-weight of the dresser tool in dressing, and executing the dressing with small consumption of the abrasive pad or the abrasive plate. SOLUTION: This polishing device comprising a turn table 1 with an abrasive pad or an abrasive plate including abrasive grain, and a top ring 3 holding a board to be ground, further comprises a dresser tool 5 kept into contact with an abrasive face of the abrasive pad 2 or the abrasive plate, and dressing the abrasive face, a dresser shaft 6, and a pressure force adjusting means composed of a controller 8 for adjusting the pressure force of the dresser tool 5 to the abrasive face of the abrasive pad 2 or the abrasive plate from a predetermined value lower than the pressure force by the self-weight of the dresser tool 5 to an arbitrary value more than the predetermined value, and a regulator 10. |
