| 摘要 |
PROBLEM TO BE SOLVED: To provide electrically conductive fine particles suitable for use in a method for joining the electrode parts of a semiconductor element and a substrate via electrically conductive fine particles, capable of conductive joining having high reliability and moreover small in adverse effects to the environment. SOLUTION: In this electrically conductive fine particles, resin fine particles are used as a base material, and a tin series alloy plated film of at least one kind selected from tin-silver alloy plating, tin-bismuth alloy plating, tin-copper alloy plating and tin-zinc alloy plating is deposited on the outermost layer.
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