| 摘要 |
A system for mounting circuit components on a circuit substrate, including a circuit-substrate supporting device which supports the circuit substrate, a circuit-component mounting device which mounts, at a circuit-component mounting position, the circuit components on the circuit substrate supported by the circuit-substrate supporting device, and a circuit-substrate carry-out device which carries out the circuit substrate on which the circuit components have been mounted, the circuit-substrate carry-out device comprising a removing device which removes the circuit substrate from the circuit-substrate supporting device, and a parallel-direction carry-out device which receives the circuit substrate from the removing device and carries out the circuit substrate in a parallel direction substantially parallel to a plane of the circuit substrate, the circuit substrate being transferred from the circuit-substrate supporting device to the removing device in a first direction substantially perpendicular to the plane of the circuit substrate, and is transferred from the removing device to the parallel-direction carry-out device in a second direction opposite to the first direction.
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