发明名称 Concentric machining device and method
摘要 There are provided a concentric machining device and method. The concentric machining device is used to machine the outer curcumferential surface of a cylindrical body having an inner diameter and an outer diameter with respect to the center of the inner diameter so that the center of the outer diameter is identical with the center of the inner diameter. In the concentric machining device, the cylindrical body is mounted in a mounting means installed in a rotating means. The rotating means rotates the mounting means and the cylindrical body according to a rotation control signal. A photographing means photographs the cross-section of the cylindrical body. A controlling means generates the rotation control signal to rotate the rotating means at a predetermined angle when the cylindrical body is mounted, calculates an eccentricity being the difference between the inner diameter center of the cylindrical body and a rotation center of the rotating means from information about the photographed cross-section received from the photographing means, and generates a machining control signal corresponding to the eccentricity. A transferring means transfers the machining control signal, and an adjusting means adjusts the position of the cylindrical body according to the machining control signal received from the transferring means so that the inner diameter center of the cylindrical body is identical with the rotation center of the rotating means.
申请公布号 US6273783(B1) 申请公布日期 2001.08.14
申请号 US19990434259 申请日期 1999.11.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM HYEON-CHEOL
分类号 B24B49/02;B23Q3/18;B23Q17/20;B23Q17/22;B23Q17/24;B24B5/04;B24B41/06;B24B49/12;B24B51/00;G01B7/12;G02B6/38;G05B19/404;(IPC1-7):B24B49/00 主分类号 B24B49/02
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