发明名称 HARDENING COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide a good adhesive property to a substrate such as a metal or a plastic by heating a t a relatively low temperature and for a short time. SOLUTION: The hardening composition comprises (A) a fluorine-containing amide compound, (B) a fluorine-containing organohydrogensiloxane having a monovalent perfluorooxyalkyl group, perfluoroalkyl group, divalent perfoluorooxyalkylene group or perfluoroalkylene group and a hydrosilyl group, (C) a platinum group compound, (D) an organosilozane having at least each one of a hydrogen atom directly bonded to a silicon atom and an epoxy group and/or a trialkoxysilyl group, (E) a silica powder having a BET specific surface area of a least 50 m2/g, (F) an organosilane or organosiloxane having a monovalent perfluorooxyalkyl group, perfluoroalkyl group, divalent perfluorooxyalkylene group or perfluoroalkylene group and having a hydroxy and/or alkoxy group directly bonded to a silicon atom.</p>
申请公布号 JP2001220509(A) 申请公布日期 2001.08.14
申请号 JP20000028762 申请日期 2000.02.07
申请人 SHIN ETSU CHEM CO LTD 发明人 SHIONO MIKIO;MATSUDA TAKASHI
分类号 C08G69/48;C08K3/34;C08K3/36;C08L71/00;C08L77/06;C08L83/08;C09J4/00;C09J177/06;C09J183/05;C09J183/06;C09J183/08;C09J183/12;(IPC1-7):C08L77/06 主分类号 C08G69/48
代理机构 代理人
主权项
地址