| 摘要 |
PROBLEM TO BE SOLVED: To prevent leakage of a resin member from a space (clearance S) between a body part constituting a resin member supply mechanism and a lower mold in a sealing molding of an electronic part. SOLUTION: In order to prevent breakage of the body part 5 of a high hardness metal and the lower mold 2 by collision impact when the resin member 7 is supplied into a pot 21, the clearance S has been formed so far. The body part 5 is divided into a support mechanism part 5A and a body mechanism part 5B, and the part 5A is incorporated with a spring mechanism 5c and suspended from the part 5B. In the supply of the resin member 7, even when the lower mold 2 on which the electronic part 3 is mounted comes in contact with the body part 5 by the elevation of the lower mold 2, the contact is alleviated by the cushioning effect of the spring mechanism 5C to obviate the clearance S, and the scattering/discharge of the resin member 7 in the pot 21 can be prevented.
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