发明名称 |
Wave soldering method and system used for the method |
摘要 |
In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.
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申请公布号 |
US6273319(B1) |
申请公布日期 |
2001.08.14 |
申请号 |
US19990229444 |
申请日期 |
1999.01.13 |
申请人 |
DENSO CORPORATION |
发明人 |
ICHIKAWA ATARU;KUBO TATSUYA;FURUMOTO ATSUSHI;ARAI KENJI;SUGIURA MITSUHIRO;TANAKA MISAO |
分类号 |
B23K1/00;B23K1/08;B23K3/06;G05D9/12;H05K3/34;(IPC1-7):B23K31/12 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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