发明名称 Wave soldering method and system used for the method
摘要 In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.
申请公布号 US6273319(B1) 申请公布日期 2001.08.14
申请号 US19990229444 申请日期 1999.01.13
申请人 DENSO CORPORATION 发明人 ICHIKAWA ATARU;KUBO TATSUYA;FURUMOTO ATSUSHI;ARAI KENJI;SUGIURA MITSUHIRO;TANAKA MISAO
分类号 B23K1/00;B23K1/08;B23K3/06;G05D9/12;H05K3/34;(IPC1-7):B23K31/12 主分类号 B23K1/00
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