ABRASIVE PAD, POLISHING METHOD AND METHOD OF MANUFACTURING WORK PIECE BY USING ABRASIVE PAD

摘要

PROBLEM TO BE SOLVED: To constantly keep the deformation characteristic of an abrasive pad in polishing to stably polish a wafer. SOLUTION: A through hole is formed from a surface of the abrasive pad to the abrasive pad of a lower layer so that the gas or the liquid included in the abrasive pad of the lower layer are movable through the through hole.