发明名称 |
EMBOSSING MOLDING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an embossing molding device which precisely performs the embossing molding of a work. SOLUTION: The embossing molding device 10 is equipped with a female mold 11 and a male mold 15 which performs the embossing molding of the work W between the male mold 15 and the female mold 11. The work W has a heat seal layer 5C which is arranged on the male mold 15 side. The male mold 15 is maintained in a cooling state and the female mold 11 is heated by a heater 19. As the heat seal layer 5C side is not heated, the work W is molded in the female mold 11 and the male mold 15 under a mitigated residual stress. |
申请公布号 |
JP2001219468(A) |
申请公布日期 |
2001.08.14 |
申请号 |
JP20000029188 |
申请日期 |
2000.02.07 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
FUKUDA ATSUSHI;OKUSHITA MASATAKA;YAMADA KAZUKI;YAMASHITA RIKIYA;MIYAMA HIROSHI |
分类号 |
B29C59/02;B29C51/08;B29C51/32;H01M2/02;(IPC1-7):B29C59/02 |
主分类号 |
B29C59/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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