发明名称 EMBOSSING MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an embossing molding device which precisely performs the embossing molding of a work. SOLUTION: The embossing molding device 10 is equipped with a female mold 11 and a male mold 15 which performs the embossing molding of the work W between the male mold 15 and the female mold 11. The work W has a heat seal layer 5C which is arranged on the male mold 15 side. The male mold 15 is maintained in a cooling state and the female mold 11 is heated by a heater 19. As the heat seal layer 5C side is not heated, the work W is molded in the female mold 11 and the male mold 15 under a mitigated residual stress.
申请公布号 JP2001219468(A) 申请公布日期 2001.08.14
申请号 JP20000029188 申请日期 2000.02.07
申请人 DAINIPPON PRINTING CO LTD 发明人 FUKUDA ATSUSHI;OKUSHITA MASATAKA;YAMADA KAZUKI;YAMASHITA RIKIYA;MIYAMA HIROSHI
分类号 B29C59/02;B29C51/08;B29C51/32;H01M2/02;(IPC1-7):B29C59/02 主分类号 B29C59/02
代理机构 代理人
主权项
地址