ACTIVE ENERGY RAY-CURING HOT-MELT ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a hot-melt adhesive which solves both the workability problems such as outgassing and heat stability and the heat resistance problems such as low level of heat resistance and the time required for heat resistance development, which have been the disadvantages of heat-resistant hot-melt adhesives. SOLUTION: The active energy ray-curing hot-melt adhesive comprises a polyester having two or more maleimide groups which optionally have constituents and a melting point of >=40 deg.C.