发明名称 MULTI-CAVITY MOLDING APPARATUS AND ITS MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a multi-cavity molding apparatus which prevents the generation of over packing in advance. SOLUTION: The multi-cavity molding apparatus 10 has a pair of molds 11, 12 forming cavities 13a, 13b, mold clamping means 15, 16 for closing the molds 11, 12 at a prescribed pressure, an injection means 20 for injecting a molten resin into the cavities 13a, 13b at a prescribed pressure with the cavities 13a, 13b closed, a control means 22 for controlling the mold clamping means 15, 16 and the injection means 20, and pressure sensors 23a, 23b for detecting the pressures of the cavities 13a, 13b. When the pressure difference between the cavities is larger than a prescribed value, the control means controls the injection means and the mold clamping means on the basis of the detected values of the sensors to decrease the injection speed of the molten resin and the mold clamping force or to stop the injection or the mold clamping.
申请公布号 JP2001219440(A) 申请公布日期 2001.08.14
申请号 JP20000038115 申请日期 2000.02.09
申请人 SONY DISC TECHNOLOGY INC 发明人 KISHI SHINSUKE;YOSHIMURA HIDEAKI
分类号 B29C45/64;B29C45/00;B29C45/46;B29C45/76;B29C45/77;(IPC1-7):B29C45/00 主分类号 B29C45/64
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