| 摘要 |
PROBLEM TO BE SOLVED: To provide an anode bonding device which provides the stable bonding and enables shortening the bonding process time at mass-production. SOLUTION: Stages 1-3 which incorporate heaters 4 are disposed on insulated thermal insulation materials 9, semiconductor silicon substrates 5 and Pyrex glass substrates 6 are mounted on the stages 1-3, furthermore thereon, metallic press electrodes 7 are placed, heat reflecting plates 8 are disposed between the stages and the bonding processes of temperature elevating of substrates, impressing of high voltage, bonding and cooling of substrates are proceeded in parallel by switching the metallic press electrodes 7 which impress high voltage by means of a high voltage switch 12.
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