发明名称 Method and apparatus for off-line testing a polishing head
摘要 A method for off-line testing a polishing head used in a CMP polishing apparatus is disclosed. The method utilizes at least two sets of pressurizing/vacuuming/venting devices for the independent testing of at least two fluid chambers which may include a membrane chamber, a retaining ring chamber and an innertube chamber normally found in a CMP polishing head. The present invention further discloses an off-line testing apparatus for a chemical mechanical polishing head which includes at least two independent sets of pressurizing/vacuuming/venting devices for testing a CMP head that is equipped with at least two fluid chambers such as a membrane chamber, a retaining ring chamber and an innertube chamber. The method and apparatus can be used advantageously for testing a variety of defects in a CMP polishing head prior to the installation of the head into a CMP apparatus. The defects include leakage between the fluid chambers, loss of vacuum seal in the fluid chambers, and binding between the fluid chambers. A pressurizing source utilized may be a general nitrogen gas in a fabrication plant. The vacuum source may be factory vacuum.
申请公布号 US6272902(B1) 申请公布日期 2001.08.14
申请号 US19990283054 申请日期 1999.01.04
申请人 TAIWAN SEMICONDUCTOR MANUFACTORING COMPANY, LTD. 发明人 CHEN WEN-TEN;LIN CHUNG-YANG;LU FANG-LIN;YEH KAU-PO
分类号 B24B37/04;B24B41/06;G01M99/00;(IPC1-7):G01N3/02;B24B29/00;B24B47/00 主分类号 B24B37/04
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