发明名称 |
Method and apparatus for off-line testing a polishing head |
摘要 |
A method for off-line testing a polishing head used in a CMP polishing apparatus is disclosed. The method utilizes at least two sets of pressurizing/vacuuming/venting devices for the independent testing of at least two fluid chambers which may include a membrane chamber, a retaining ring chamber and an innertube chamber normally found in a CMP polishing head. The present invention further discloses an off-line testing apparatus for a chemical mechanical polishing head which includes at least two independent sets of pressurizing/vacuuming/venting devices for testing a CMP head that is equipped with at least two fluid chambers such as a membrane chamber, a retaining ring chamber and an innertube chamber. The method and apparatus can be used advantageously for testing a variety of defects in a CMP polishing head prior to the installation of the head into a CMP apparatus. The defects include leakage between the fluid chambers, loss of vacuum seal in the fluid chambers, and binding between the fluid chambers. A pressurizing source utilized may be a general nitrogen gas in a fabrication plant. The vacuum source may be factory vacuum.
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申请公布号 |
US6272902(B1) |
申请公布日期 |
2001.08.14 |
申请号 |
US19990283054 |
申请日期 |
1999.01.04 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTORING COMPANY, LTD. |
发明人 |
CHEN WEN-TEN;LIN CHUNG-YANG;LU FANG-LIN;YEH KAU-PO |
分类号 |
B24B37/04;B24B41/06;G01M99/00;(IPC1-7):G01N3/02;B24B29/00;B24B47/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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