| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma sputtering system by which a thin film of required components is deposited on a surface, and a high capacity material is produced by utilizing an electoron beam exciting plasma system and utilizing a solid target in place of gas as for a part of components. SOLUTION: In an electron beam exciting plasma system provided with a discharge chamber 1 and a process chamber 2 adjacent thereto via a bottleneck and installed with an accelerating electrode 21 and a sample stand 3, target 4 is arranged at the process chamber 2, reaction plasma is acted, and sputtering is performed.
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