发明名称 Pre-conditioning polishing pads for chemical-mechanical polishing
摘要 A preconditioning mechanism for preconditioning a polishing pad is described. The preconditioning mechanism includes an arm capable of being disposed over the polishing pad and a head section located on a distal end of the arm and rotatable about a central axis. Furthermore, the head section includes at least two heads oriented about the central axis and have surfaces for either conditioning or preconditioning the polishing pad, whereby rotation of the head section about the central axis by defined amounts presents at least two heads to the polishing pad so that different of the two heads can engage the polishing pad for conditioning or preconditioning depending upon how far rotation has proceeded.
申请公布号 US6273798(B1) 申请公布日期 2001.08.14
申请号 US19990362648 申请日期 1999.07.27
申请人 LSI LOGIC CORPORATION 发明人 BERMAN MICHAEL J.
分类号 B24B37/00;B24B37/04;B24B53/007;H01L21/304;(IPC1-7):B24B21/18 主分类号 B24B37/00
代理机构 代理人
主权项
地址