发明名称 |
In-situ automated CMP wedge conditioner |
摘要 |
An apparatus and method of conditioning a CMP polishing pad to ensure consistent polishing throughout the polishing process. In particular, the apparatus consists of a translatable wedge-shaped conditioning plate, having a three point adjustable contact to ensure proper alignment with the polishing pad; a high pressure conditioning spray nozzle to clean the polishing pad and conditioning assembly throughout polishing; and a slurry dispensing nozzle to enhance planarization of the wafer. Further, the frequency of oscillation may be varied by the operator to prevent grooves from forming in the polishing pad.
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申请公布号 |
US6273797(B1) |
申请公布日期 |
2001.08.14 |
申请号 |
US19990444285 |
申请日期 |
1999.11.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BECKER KENT R.;CLINE SCOTT R.;MANFREDI PAUL A.;NADEAU DOUGLAS P. |
分类号 |
B24B37/04;B24B53/007;B24B53/12;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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