发明名称 |
Thermoelectric module with improved heat-transfer efficiency and method of manufacturing the same |
摘要 |
A thermoelectric chip with exposed surfaces of N-type and P-type semiconductor elements on its top and bottom surfaces is prepared by arranging the semiconductor elements in a matrix manner such that each of the N-type semiconductor elements is disposed adjacent to the P-type semiconductor element through a space, and filling the space with a first resin material having electrical insulation. A metal layer is formed on each of the exposed surfaces of the semiconductor elements. Then, first electrodes are formed on the top surface according to a first circuit pattern. Similarly, second electrodes are formed on the bottom surface according to a second circuit pattern different from the first circuit pattern. An electrical insulation sheet of a second resin material containing a ceramic powder with high thermal conductivity is bonded to the top and bottom surfaces to obtain the thermoelectric module.
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申请公布号 |
US6274803(B1) |
申请公布日期 |
2001.08.14 |
申请号 |
US20000574069 |
申请日期 |
2000.05.18 |
申请人 |
MATSUSHITA ELECTRIC WORKS, LTD. |
发明人 |
YOSHIOKA HIROKAZU;KAMADA KAZUO;URANO YOJI;KOBAYASHI KENTARO |
分类号 |
H05K1/00;H01L35/32;H01L35/34;(IPC1-7):H01L35/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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