发明名称 |
Method for producing a plastic molded semiconductor package |
摘要 |
In construction of a plastic molded semiconductor package provided with a heat sink and electrically conductive leads attached to the periphery of the heat sink, a conventional electrically insulating, adhesive bonding tape is replaced by a non-adhesive insulating sheet and support bars are locally provided in a lead frame between the leads. For uniting the leads to the heat sink, the support bars are fixed to the heat sink whilst sandwiching the insulating sheet. Elimination of the adhesive bonding tape greatly reduces intrusion of contaminants into the package, simplifies the production process and lowers the production cost.
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申请公布号 |
US6274408(B1) |
申请公布日期 |
2001.08.14 |
申请号 |
US19990431185 |
申请日期 |
1999.11.01 |
申请人 |
KABUSHIKI KAISHA GOTOH SEISAKUSHO |
发明人 |
WATANABE NORINAGA;NISHI SHINICHI |
分类号 |
H01L21/56;H01L23/433;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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